Diode Bar Scribe/Cleave Operator

An organization within Northrop Grumman’s Payload and Ground Systems (PGS) division, Cutting Edge Optronics is a leading provider of high-power laser diode arrays, high power pump modules and diode-pumped solid-state (DPSS) lasers. We are a vertically integrated manufacturer capable of supplying unmounted diode bars, packaged laser diodes, DPSS modules, laser diode drivers and complete DPSS laser systems. Our diode laser-based products have become industry standards and are used in a wide variety of commercial and military applications. 

Learn more about Cutting Edge Optronics at our website: https://www.northropgrumman.com/who-we-are/cutting-edge-optronics/. 

Northrop Grumman - Cutting Edge Optronics (CEO) is looking for a highly motivated Scribe/Cleave operator.  The Scribe/Cleave operator will perform operations associated with the scribing/cleaving of laser diode products. All work takes place in a team-oriented cleanroom. Responsibilities are subject to change dependent upon your personal experience/strengths and specific needs of Cutting Edge Optronics.

Responsibilities:

• Perform a variety of tasks related to operating specialized equipment in a class 100 cleanroom to scribe/cleave wafers and load/unload diode bars

• Operate complex processing equipment like scribe dicing, and bar loading/unloading machines

• Carefully handle delicate diode bars using specialized tools like vacuum pencils

• Perform in-process inspections using microscopes and other metrology tools to identify defects and ensure quality standards are met

• Record and analyze process data to identify trends, troubleshoot issues, and optimize production parameters

• Adhere to strict cleanroom procedures to maintain a contamination-free environment

• Maintain detailed records of process steps, equipment settings, and inspection results

• Meticulous attention to detail and adherence to strict quality control standards

• Read and follow work instructions or other materials to determine specifications and procedures

Basic Qualifications:

• High school diploma or equivalent and 1 year of experience.

• Strong visual acuity and attention to detail

• Exceptional fine motor skills, including the ability to handle small, fragile materials using tweezers or vacuum pens

• Experience using microscopes

• Good oral communication and interpersonal skills

• Cleanroom experience

• Willingness and capability to learn new tasks

Preferred Qualifications:

• Prior Semiconductor wafer processing experience

• Experience using a stereo zoom or high-power microscope

• Experience with Microsoft Office software (Outlook, Word, Excel, and PowerPoint)

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.